The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10606327 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 31, 2020

Filed:

Jun. 16, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Victor Chiriac, Phoenix, AZ (US);

Jorge Rosales, San Diego, CA (US);

Peng Wang, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); G06F 1/20 (2006.01); G03B 17/55 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G06F 1/20 (2013.01); H01L 23/367 (2013.01); H05K 7/20445 (2013.01); H05K 7/20963 (2013.01);
Abstract

Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.


Find Patent Forward Citations

Chiriac, Victor. (2020). Heat reduction using selective insulation and thermal spreading (U.S. Patent No. 10606327). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10606327

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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