The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Feb. 21, 2019
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Sean Charles Andrews, Solana Beach, CA (US);

Jorge Luis Rosales, San Diego, CA (US);

Victor Adrian Chiriac, Phoenix, AZ (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 21/08 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28D 15/02 (2013.01); F28F 21/085 (2013.01); F28F 21/089 (2013.01); H01L 23/4275 (2013.01);
Abstract

An example heat-dissipating device with enhanced interfacial properties generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer including a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.


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