Jooyaung Eom

Title: Jooyaung Eom and Semiconductor Device Innovation.

Introduction

Jooyaung Eom is an inventor based in Gimpo, South Korea. His patent work focuses on semiconductor devices, including chip packaging and power modules for inverter applications. He is associated with Power Master Semiconductor Co., Ltd. and is credited with 3 patents.

Latest Patents

Eom’s listed patents describe two approaches to semiconductor device design.

One patent presents a device with two semiconductor chips mounted on a substrate. A lead frame connects to the upper surfaces of both chips and extends beyond the substrate. A heat sink is positioned over the chip regions, while a groove in the lead frame separates the areas connected to each chip. The design addresses the arrangement of components and heat-management structures within a semiconductor package.

The other patent describes a semiconductor module package for driving an inverter. It arranges chips for right-phase and left-phase switching patterns in separate rows on upper metal layers. Connections link chips in each row in series, with the first row also connected in parallel to the second upper metal layer. This configuration sets out an electrical arrangement for the module’s switching components.

Career Highlights

The available patent information highlights Eom’s contributions to semiconductor packaging and inverter-module architecture. His work addresses both physical device construction and the electrical connections among semiconductor chips.

Collaborations

Eom is associated with Power Master Semiconductor Co., Ltd. His listed coworkers include Taekkeun Lee and Ki-Myung Yoon.

Conclusion

Jooyaung Eom’s patent portfolio reflects a focus on semiconductor devices, combining package-level design considerations with circuit arrangements for inverter modules.