The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Sep. 14, 2022
Applicant:

Power Master Semiconductor Co., Ltd., Cheongju-si, KR;

Inventors:

Ki-Myung Yoon, Bucheon-si, KR;

In-Suk Kim, Bucheon-si, KR;

Jooyaung Eom, Gimpo-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/10 (2026.01); H10W 40/40 (2026.01); H10W 70/40 (2026.01); H10W 74/10 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/10 (2026.01); H10W 40/40 (2026.01); H10W 70/461 (2026.01); H10W 74/111 (2026.01); H10W 72/07354 (2026.01); H10W 72/347 (2026.01); H10W 90/00 (2026.01); H10W 90/736 (2026.01);
Abstract

Provided are a dual cooling semiconductor device and a dual cooling semiconductor system. The dual cooling semiconductor device includes: a first cooling structure and a second cooling structure each including a thermally conductive electrical insulation layer; a first internal metal plate formed on an upper surface of the second cooling structure; a second internal metal plate formed on a lower surface of the first cooling structure; a third internal metal plate formed on the first internal metal plate and supporting a semiconductor chip; a metal block formed on the semiconductor chip; and a fourth internal metal plate formed below the second internal metal plate and having a metal block insertion hole into which the metal block is inserted.


Find Patent Forward Citations

Quick Actions:

Yoon, Ki-Myung. (2026). Both-surface cooling semiconductor device (U.S. Patent No. 12772839). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772839

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…