The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Dec. 26, 2023
Applicant:

Power Master Semiconductor Co., Ltd., Cheongju-si, KR;

Inventors:

Taekkeun Lee, Seoul, KR;

In-Suk Kim, Bucheon-si, KR;

Ki-Myung Yoon, Bucheon-si, KR;

Jooyaung Eom, Gimpo-si, KR;

Soonho Kwon, Bucheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 72/60 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/255 (2026.01); H10W 90/00 (2026.01); H10W 72/621 (2026.01); H10W 90/763 (2026.01); H10W 90/764 (2026.01);
Abstract

Provided is a semiconductor device. A semiconductor device is implemented as a semiconductor module package for driving an inverter, the semiconductor device may include: a first upper metal layer in which a plurality of semiconductor chips implementing a right phase switching pattern are disposed along a first direction to form a first row; a second upper metal layer in which a plurality of semiconductor chips implementing a left phase switching pattern are disposed along the first direction to form a second row; a first connection, in the first upper metal layer, connecting a plurality of semiconductor chips disposed along the first row to each other in series and to the second upper metal layer in parallel; and a second connection, in the second upper metal layer, connecting a plurality of semiconductor chips disposed along the second row to each other in series.


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Lee, Taekkeun. (2026). Semiconductor device (U.S. Patent No. 12733496). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12733496

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