Taekkeun Lee

Title: Taekkeun Lee: Semiconductor Device Inventor

Introduction

Taekkeun Lee is an inventor based in Seoul, South Korea. His work focuses on semiconductor devices and packaging designs, including technologies for semiconductor modules and inverter applications. He is associated with Power Master Semiconductor Co., Ltd. Lee is credited with 2 patents.

Latest Patents

Lee’s listed patents describe two semiconductor device designs.

One patent presents a device with two semiconductor chips mounted at a distance from each other on a substrate. A lead frame extends beyond the substrate and connects to the upper surfaces of both chips. A heat sink is positioned over the chip regions, while a groove in the lead frame lies between the areas connected to the two chips.

The other patent describes a semiconductor module package for driving an inverter. It arranges semiconductor chips in separate rows to implement right- and left-phase switching patterns. Connections link chips in each row in series, with the first row also connected in parallel to the second upper metal layer.

Career Highlights

Lee’s patent work addresses semiconductor packaging, chip arrangement, electrical interconnections, and heat management. These designs reflect engineering approaches to organizing semiconductor components within devices and inverter modules.

Collaborations

Lee is associated with Power Master Semiconductor Co., Ltd. His listed coworkers include Ki-Myung Yoon and Jooyaung Eom.

Conclusion

Taekkeun Lee’s two listed patents focus on semiconductor device structures, combining chip placement, lead-frame design, thermal management, and inverter-module connections.