Jongpa Hong

Introduction

Jongpa Hong is a notable inventor based in Suwon-si, South Korea, recognized for his significant contributions to semiconductor technology. With a total of four patents to his name, he has been instrumental in developing advanced semiconductor packages that enhance performance and connectivity.

Latest Patents

Among his recent inventions, two standout patents highlight his innovative prowess:

1. **Semiconductor package and method of fabricating the same**: This patent discloses semiconductor packages that include connection terminals between a first die and a second die. The first die consists of signal and peripheral regions, featuring first vias on the peripheral region. The second die, positioned atop the first die, has second vias aligned with the first vias. The connection terminals bridge these vias, optimizing connectivity. Moreover, the design incorporates first and second connection terminals strategically placed in regions adjacent to the corners and lateral surfaces of the first die, ensuring effective performance.

2. **Semiconductor package with curing layer between semiconductor chips**: This invention presents a semiconductor package comprising a lower semiconductor chip with a substrate and upper pads. An upper semiconductor chip is stacked above it and features solder bumps on its underside. A unique aspect of this package is the inclusion of a curing layer between the two chips, consisting of a photo-curing agent adjacent to the upper chip and a thermo-curing agent nearer to the lower substrate. This innovative design aims to enhance the reliability and function of the semiconductor package.

Career Highlights

Jongpa currently serves as an inventor at Samsung Electronics Co., Ltd., one of the leading technology companies globally. His work at this esteemed organization underscores his commitment to pushing the boundaries of semiconductor innovation and technology.

Collaborations

Throughout his career, Jongpa has collaborated with talented colleagues such as Jiseok Hong and Hyuekjae Lee. These collaborations not only foster innovation but also enable the sharing of insights and expertise within the realm of semiconductor research and development.

Conclusion

Jongpa Hong's creativity and technical acumen have led to groundbreaking advancements in semiconductor technology. His patents reflect a deep understanding of the complexities involved in semiconductor packaging, paving the way for enhanced device performance and reliability. His contributions continue to shape the future of the industry, positioning him as a key figure in semiconductor innovation.