The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Aug. 23, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip including first front connection pads on a first front surface, first rear connection pads and dummy pads on a first rear surface, and through-electrodes. The package includes a second semiconductor chip including second front connection pads and test pads on a second front surface, and a protective layer including openings exposing at least a portion of the second front connection pads and the test pads. The package includes bump structures electrically connecting the first rear connection pads and the second front connection pads, and an adhesive film surrounding at least a portion of each of the first rear connection pads, the dummy pads, and the bump structures. The dummy pads overlap the test pads in a direction perpendicular to the first rear surface, and a height of the dummy pads is greater than a height of the first rear connection pads.