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For the Inventor, By the Inventor

Taichung, Taiwan

Jong Sik Paek

This inventor holds 11 USPTO granted patents and 12 published patent applications. Top assignee: Micron Technology Incorporated. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong Sik Paek. Retrieved from https://idiyas.com/inventor/jong-sik-paek-2hcnhpkc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11 

% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal11 out of 39,253 
 
Micron Technology Incorporated
 patents

Years Active: 2022-2026

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11 patents (USPTO):Explore Patents
1. 12543583 - Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules (2026-02-03),
2. 12347737 - Semiconductor device with a porous air vent (2025-07-01),
3. 12125816 - Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same (2024-10-22),
4. 12051684 - Face-to-face semiconductor device with fan-out porch (2024-07-30),
5. 11942455 - Stacked semiconductor dies for semiconductor device assemblies (2024-03-26),
6. 11942430 - Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules (2024-03-26),
7. 11764161 - Ground connection for semiconductor device assembly (2023-09-19),
8. 11749665 - Face-to-face semiconductor device with fan-out porch (2023-09-05),
9. 11515174 - Semiconductor devices with package-level compartmental shielding and associated systems and methods (2022-11-29),
10. 11456289 - Face-to-face semiconductor device with fan-out porch (2022-09-27),
11. 11362071 - Stacked semiconductor dies for semiconductor device assemblies (2022-06-14),

Title: Innovations of Jong Sik Paek

Introduction

Jong Sik Paek is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

One of his latest patents is for a semiconductor device with a porous air vent. This invention discloses techniques, apparatuses, and systems that allow air to pass from an area between the semiconductor die and the substrate while retaining the underfill material. This innovation helps limit voids and back contamination, leading to the assembly of a more reliable semiconductor device. Another notable patent involves semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL). This assembly includes a first die embedded in the RDL and one or more second dies electrically coupled to internal contacts, encapsulated for protection.

Career Highlights

Jong Sik Paek is currently employed at Micron Technology Incorporated, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced semiconductor solutions that meet the demands of modern electronics.

Collaborations

He has collaborated with notable coworkers such as Yeongbeom Ko and Youngik Kwon, contributing to various innovative projects within the semiconductor industry.

Conclusion

Jong Sik Paek's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of reliable and efficient semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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