This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jonathan Atkins and Semiconductor Packaging Innovation.
Introduction
Jonathan Atkins is an inventor based in Phoenix, Arizona, and is associated with Intel Corporation. His patent work concerns advanced electronic packaging and connections between semiconductor dies.
Latest Patents
Atkins is credited with 1 patent: “TSV-Type Embedded Multi-Die Interconnect Bridge Enabling with Thermal Compression Non-Conductive Film (TC-NCF) Process.” The disclosed electronic package includes a package substrate with an opening and a bridge die positioned within it. Pads at the bottom of the opening connect to pads on the bridge die through solder, while non-conductive film surrounds the solder joints.
Career Highlights
The patent describes an approach to integrating a bridge die into a package substrate, with the aim of enabling interconnection among multiple dies. Its use of solder connections and non-conductive film is central to the disclosed packaging structure.
Collaborations
Atkins’s listed coworkers include Minglu Liu and Gang Duan. The patent’s technical subject reflects collaborative work in semiconductor packaging at Intel Corporation.
Conclusion
Jonathan Atkins’s patent highlights an electronic packaging design that embeds a multi-die interconnect bridge and uses non-conductive film around solder connections.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile