The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 27, 2022
Intel Corporation, Santa Clara, CA (US);
Minglu Liu, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Liang He, Chandler, AZ (US);
Ziyin Lin, Chandler, AZ (US);
Elizabeth Nofen, Phoenix, AZ (US);
Yiqun Bai, Chandler, AZ (US);
Jonathan Atkins, Phoenix, AZ (US);
Jesus S. Nieto Pescador, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.