Jon Woodyard

Title: Jon Woodyard: Innovator in Through-Via Technology

Introduction

Jon Woodyard is a notable inventor based in Livermore, CA (US). He has made significant contributions to the field of substrate technology, particularly in the area of through-vias. His innovative approach has led to the development of a unique patent that enhances the efficiency of filling through-vias in substrates.

Latest Patents

Jon Woodyard holds a patent for a "Single side via fill process for through-vias." This patent describes methods and apparatus for single side filling of through-vias in a substrate. The process involves coupling a first side of the substrate, which has through-vias, to a carrier plate using an adhesive layer. The through-vias are then exposed to a conductive layer situated between the carrier plate and the substrate. Finally, the substrate is plated using the conductive layer as a seed layer to fill the through-vias with a conductive material. This innovative method streamlines the manufacturing process and improves the reliability of electronic components.

Career Highlights

Jon Woodyard is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at Applied Materials has allowed him to collaborate with other talented professionals and contribute to cutting-edge technologies. His dedication to innovation is evident in his patent and the impact it has on the industry.

Collaborations

Jon has worked alongside Marvin L. Bernt, a fellow innovator in the field. Their collaboration has fostered an environment of creativity and advancement in substrate technology.

Conclusion

Jon Woodyard's contributions to the field of substrate technology through his innovative patent demonstrate his commitment to advancing the industry. His work at Applied Materials, Inc. continues to influence the development of efficient manufacturing processes.