Applied Materials, Inc.

Jon Woodyard

Marvin L Bernt

Methods and apparatus for single side filling of through-vias in a substrate are provided herein. In some embodiments, a method of filling through-vias in a substrate includes: coupling a first side of the substrate having through-vias to a carrier plate with an adhesive layer; exposing the through-vias to a conductive layer disposed between the carrier plate and the first side of the substrate; and plating the substrate using the conductive layer as a conductive seed layer to fill the through-vias with a conductive material.

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Livermore, CA, United States of America

Jon Woodyard