Johnnie Quan

Title: Innovations of Johnnie Quan

Introduction

Johnnie Quan is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his expertise and innovative spirit.

Latest Patents

One of his latest patents is titled "Methods for temporary bussing of semiconductor package substrates." This invention discloses methods that include metal plating regions of a packaging substrate utilizing a plurality of bussed traces. These traces can be decoupled by forming debuss holes at their intersections. The decoupled traces are then electrically tested, and the packaging substrate can be singulated into multiple substrates through a sawing process. The traces are electrically coupled via plating bars located in the singulation areas, with the intersections of the bussed traces arranged in a Y pattern. The debuss holes can be formed using mechanical drilling or lasing, and the regions of the packaging substrate are metal plated through an electroplating process.

Another significant patent by Johnnie Quan is for an "Integrated circuit with efficient MEMS architecture." This electrical circuit features a spatially-efficient MEMS architecture, which is described in detail in the associated claims.

Career Highlights

Johnnie Quan is currently employed at Amkor Technology, Inc., where he continues to innovate in the semiconductor industry. His work has contributed to advancements in packaging technologies that are crucial for modern electronics.

Collaborations

Throughout his career, Johnnie has collaborated with notable colleagues, including August Joseph Miller, Jr. and Kurt Raymond Raab. These collaborations have further enhanced his contributions to the field.

Conclusion

Johnnie Quan's innovative work in semiconductor packaging has led to valuable patents that advance technology in this critical area. His contributions reflect a commitment to excellence and innovation in the field.