This inventor holds 1 USPTO granted patent. Top assignee: Asm Technology Singapore Pte Ltd. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: John Hon Shing Lau: Semiconductor Packaging Innovation.
Introduction
John Hon Shing Lau is an inventor based in Palo Alto, California. His work includes a patented method for applying underfill material in semiconductor packaging. The method uses a stencil and heat to help the material flow between a semiconductor die and its substrate.
Latest Patents
Lau is associated with 1 patent: “Thermally-Enhanced Provision of Underfill to Electronic Devices Using a Stencil.” The invention describes positioning a stencil with an elongated slot beside an edge of a bonded semiconductor die. Underfill material is printed through the slot onto the substrate, next to the die. Heating then encourages the material to flow by capillary action through the space between the die and substrate, from one edge to the opposite edge.
Career Highlights
Lau is associated with ASM Technology Singapore Pte Ltd. His patent addresses the controlled delivery of underfill material, a process used in assembling semiconductor devices.
Collaborations
Lau’s listed coworkers include Qinglong Zhang and Yiu Ming Cheung.
Conclusion
John Hon Shing Lau’s patent presents a stencil-based, thermally assisted approach to applying underfill in semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile