John Hon-Shing Lau

Title: John Hon-Shing Lau: Innovator in Package Structure Manufacturing

Introduction

John Hon-Shing Lau is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of manufacturing methods, particularly in the development of package structures. His innovative approach has led to the creation of a patented method that enhances the efficiency and effectiveness of packaging technology.

Latest Patents

John Hon-Shing Lau holds a patent for a manufacturing method of package structure. This method involves several steps, including the formation of an insulating composite layer on a metal layer of a carrier board. A chip packaging module, which includes a sealant and a first chip embedded within, is placed on the insulating composite layer. The first chip is equipped with multiple conductive pads. A first circuit layer module, consisting of a dielectric layer and a circuit layer, is then formed on the chip packaging module. This circuit layer is electrically connected to the conductive pads through conductive vias in the dielectric layer. Additionally, a second chip is placed on the first circuit layer module, followed by the formation of a second circuit layer module on both the first circuit layer module and the second chip. Finally, a protecting layer is established on the second circuit layer module. This innovative method showcases Lau's expertise in enhancing packaging technology.

Career Highlights

John Hon-Shing Lau is associated with Unimicron Technology Corporation, where he has been instrumental in advancing packaging technologies. His work has not only contributed to the company's success but has also positioned him as a key figure in the industry. Lau's dedication to innovation is evident in his patent and the impact it has on manufacturing processes.

Collaborations

Throughout his career, John Hon-Shing Lau has collaborated with talented individuals such as Kai-Ming Yang and Chen-Hao Lin. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

John Hon-Shing Lau is a distinguished inventor whose contributions to the manufacturing of package structures have made a significant impact in the field. His patented method exemplifies his innovative spirit and commitment to advancing technology. Lau's work continues to inspire future developments in packaging solutions.