This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2008-2010.
Company Filing History:
Years Active: 2008-2010
Title: Innovations of John C Conner
Introduction
John C Conner is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit technology. With a total of 3 patents, his work has had a considerable impact on the industry.
Latest Patents
One of his latest patents is titled "Integrated circuit device mounting with folded substrate and interposer." In this invention, a package-to-package stack is assembled, comprising a first integrated circuit package and a second integrated circuit package, which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed. Another significant patent is the "Method and apparatus for trace shielding and routing on a substrate." This invention effectively shields signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Additionally, it provides improved power delivery without affecting the signal trace routing on the metal layers of the substrate. Other embodiments of this invention are also described in the claims.
Career Highlights
John C Conner is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has allowed him to be at the forefront of advancements in integrated circuits.
Collaborations
Throughout his career, John has collaborated with talented individuals such as Brian Taggart and Robert M Nickerson. These collaborations have contributed to the success of his projects and innovations.
Conclusion
John C Conner's contributions to integrated circuit technology through his patents and work at Intel Corporation highlight his importance as an inventor. His innovative spirit continues to drive advancements in the field.