The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7358444 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 15, 2008

Filed:

Oct. 13, 2004
Applicants:

Robert M. Nickerson, Chandler, AZ (US);

Ronald L. Spreitzer, Phoenix, AZ (US);

John C. Conner, Chandler, AZ (US);

Brian Taggart, Phoenix, AZ (US);

Inventors:

Robert M. Nickerson, Chandler, AZ (US);

Ronald L. Spreitzer, Phoenix, AZ (US);

John C. Conner, Chandler, AZ (US);

Brian Taggart, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.


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Nickerson, Robert. (2008). Folded substrate with interposer package for integrated circuit devices (U.S. Patent No. 7358444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7358444

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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