John A Harada

Title: Innovations of John A Harada

Introduction

John A Harada is a notable inventor based in Mountain View, CA. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on innovative chip packaging techniques that enhance the performance and efficiency of semiconductor devices.

Latest Patents

One of Harada's latest patents is for a chip package with a plank stack of semiconductor dies. This design features semiconductor dies arranged in a vertical stack, separated by mechanical spacers. The chip package includes a substrate positioned at a right angle to the plank stack, facilitating high-bandwidth communication between the semiconductor dies and the substrate. Another notable patent involves a manufacturing fixture for a ramp-stack chip package that utilizes solder for coupling a ramp component. This assembly technique allows for a set of semiconductor dies to be arranged in a vertical stack while being offset horizontally, creating a stepped terrace.

Career Highlights

Throughout his career, John A Harada has worked with prominent companies such as Oracle America, Inc. and Oracle International Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Harada has collaborated with notable colleagues, including David C Douglas and Robert J Drost. These partnerships have likely fostered a creative environment that has led to the development of his innovative patents.

Conclusion

John A Harada's contributions to semiconductor technology through his patents demonstrate his commitment to innovation in the field. His work continues to influence the design and functionality of chip packages, showcasing the importance of advancements in this area.