This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2005-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005-2020
Title: Innovations by Joel Tomas Medina
Introduction
Joel Tomas Medina is a notable inventor based in Baguio, Philippines. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Among his latest patents is a semiconductor package featuring a metal barrier. This innovative device includes a barrier metal layer positioned over a metallization layer, along with an under bump metallurgy layer and a solder bump. Another significant patent involves grooved substrates designed for uniform underfilling in solder ball assembled electronic devices. This semiconductor assembly comprises a semiconductor device with multiple metallic contact pads and an insulating substrate that matches the device's contact pad locations.
Career Highlights
Joel Tomas Medina is currently employed at Texas Instruments Corporation, where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise has contributed to advancements in the industry, making him a valuable asset to his company.
Collaborations
He has collaborated with several talented individuals, including Jeremias Perez Libres and Mary C. Miller, who have worked alongside him on various projects.
Conclusion
Joel Tomas Medina's innovative work in semiconductor technology showcases his dedication to improving electronic devices. His patents reflect his commitment to advancing the field and highlight his role as a prominent inventor.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
