Texas Instruments Corporation

Joel Tomas Medina

Jeremias Perez Libres

Mary C Miller

Kazuaki Ano

Armando Tresvalles Clarina, Jr

Jay-Ar Tumaru Flores

Maria Alesssandra Azurin

Ruby Ann Dizon Mamangun

Erwin R Estepa

A semiconductor device having a barrier metal layer positioned over a metallization layer, and an under bump metallurgy layer over the barrier metal layer, and a solder bump over the under bump metallurgy layer.

Semiconductor package having a metal barrier

A semiconductor assembly () comprising a semiconductor device (), which has a plurality of metallic contact pads () and an outline by sides (). A metallic bump () made of reflowable metal is attached to each of these contact pads. An electrically insulating substrate () has a surface with a plurality of metallic terminal pads () in locations matching the locations of the device contact pads, and further a plurality of grooves () and humps () distributed between the terminal pad locations, complementing the distribution of the terminal pads. Each bump is further attached to its matching terminal pad, respectively; the device is thus interconnected with the substrate and spaced apart by a gap (). Adherent polymeric material () containing inorganic fillers fills the gap substantially without voids.

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of assembling an integrated circuit includes providing a substrate having electrical terminals on a first side of the substrate and a bondpad on a second side of the substrate opposing the first side. In this embodiment, the bondpad is electrically coupled to at least one of the terminals on the first side. In addition, the method includes mounting an integrated circuit chip to the first side of the substrate, where the integrated circuit component has a lead adapted to be wire-bonded to the terminal. The method further includes removing oxidation from the bondpad, where the bondpad is adapted to be metallurgically bonded to a trace on a printed circuit board. Moreover, this embodiment of the method includes metallurgically bonding the bondpad to the trace.

Low cost substrate for an integrated circuit device with bondpads free of plated gold

Growing community of inventors

Baguio, Philippines

Joel Tomas Medina