The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Mar. 01, 2006
Jeremias P. Libres, Garland, TX (US);
Joel T. Medina, Baguio, PH;
Mary C. Miller, Richardson, TX (US);
Jeremias P. Libres, Garland, TX (US);
Joel T. Medina, Baguio, PH;
Mary C. Miller, Richardson, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor assembly () comprising a semiconductor device (), which has a plurality of metallic contact pads () and an outline by sides (). A metallic bump () made of reflowable metal is attached to each of these contact pads. An electrically insulating substrate () has a surface with a plurality of metallic terminal pads () in locations matching the locations of the device contact pads, and further a plurality of grooves () and humps () distributed between the terminal pad locations, complementing the distribution of the terminal pads. Each bump is further attached to its matching terminal pad, respectively; the device is thus interconnected with the substrate and spaced apart by a gap (). Adherent polymeric material () containing inorganic fillers fills the gap substantially without voids.