Job Ha

Title: Job Ha - Innovator in Semiconductor Packaging

Introduction

Job Ha is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His innovative designs have advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Among his latest patents, Job Ha has developed a semiconductor package that includes a frame with first and second surfaces opposite to each other. This package features first and second through holes and a wiring structure that connects the two surfaces. Additionally, it incorporates a connection structure on the first surface, which has a redistribution layer linked to the wiring structure. The design includes a first semiconductor chip with a pad connected to the redistribution layer and a second pad on its opposite surface. Another notable patent describes a semiconductor package that consists of a connection member with multiple connection pads and a redistribution layer, encapsulating a semiconductor chip and featuring a passivation layer with under bump metallurgy (UBM) pads.

Career Highlights

Job Ha has worked with leading companies in the technology sector, including Samsung Electro-Mechanics Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Job Ha has collaborated with talented individuals such as Eun Jung Jo and Sun Woo Yun. These partnerships have fostered innovation and creativity in their projects.

Conclusion

Job Ha's contributions to semiconductor packaging have established him as a key figure in the industry. His patents reflect his commitment to innovation and excellence in technology.