The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
May. 12, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventor:
Job Ha, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/373 (2013.01); H01L 23/49562 (2013.01);
Abstract
Disclosed herein are a power module package and a method of manufacturing the same. The power module package includes first and second semiconductor devices mounted on sides of first and second lead frames, ends of which are separated from each other, respectively, a support pin corresponding to a mounting position of the first semiconductor device and formed adjacent to a lower portion of the first lead frame, and a molding portion formed to cover portions of the first and second lead frames and the first and second semiconductor devices.