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For the Inventor, By the Inventor

Graz, Austria

Joachim Heinz Schober

This inventor holds 12 USPTO granted patents. Top assignees: Koninklijke Philips Corporation N.v., Nxp B.v.. Active years: 2003-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joachim Heinz Schober. Retrieved from https://idiyas.com/inventor/joachim-heinz-schober

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 75.0

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Graz, AU (2003)
  • Vienna, AT (2010)
  • Graz, AT (2003 - 2015)

Company Filing History:

goldMedal7 out of 21,910 
 
Koninklijke Philips Corporation N.v.
 patents
silverMedal5 out of 5,334 
 
Nxp B.v.
 patents

Years Active: 2003-2015

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12 patents (USPTO):Explore Patents
1. 9047548 - Semiconductor chip, transponder and method of manufacturing a transponder (2015-06-02),
2. 8695881 - Chip card for insertion into a holder (2014-04-15),
3. 8659132 - Microelectronic package assembly, method for disconnecting a microelectronic package (2014-02-25),
4. 7733657 - Module base unit with strain relief means (2010-06-08),
5. 7245005 - Lead-frame configuration for chips (2007-07-17),
6. 7124956 - Product comprising product sub-parts connected to each other by a crimp connection (2006-10-24),
7. 6712279 - Data carrier comprising an array of contacts (2004-03-30),
8. 6657294 - Data carrier having an IC module with a protection mechanism for protecting the parts of the IC module from mechanical stress (2003-12-02),
9. 6643142 - Module having a lead frame equipped with components on both sides (2003-11-04),
10. 6593664 - Chip module with bond-wire connections with small loop height (2003-07-15),
11. 6567169 - Method of and device for determining the warpage of a wafer (2003-05-20),
12. 6552422 - Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component (2003-04-22),

Title: The Innovative Contributions of Joachim Heinz Schober

Introduction

Joachim Heinz Schober is a notable inventor based in Graz, Austria. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work has had a profound impact on the development of various electronic devices.

Latest Patents

Schober's latest patents include a semiconductor chip designed for a transponder. This semiconductor chip comprises a chip substrate with a surface, chip terminals arranged on the surface, and a passivation layer covering the surface and completely covering the chip terminals. This design allows for an antenna with antenna terminals to be attached to the chip above the chip terminals, forming first capacitors. Another notable patent is for a chip card, particularly a SIM card, which is designed for insertion into a holder equipped with electrical device contacts and a press-on device. The chip card includes a substrate, a contact field, a chip, and a single-piece encapsulation that ensures reliable electrical contact upon insertion.

Career Highlights

Throughout his career, Schober has worked with prominent companies such as Koninklijke Philips Corporation N.V. and NXP B.V. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Schober has collaborated with notable professionals in his field, including Marcus Toth and Gerald Schaffler. These collaborations have further enhanced his contributions to the industry.

Conclusion

Joachim Heinz Schober's innovative work in semiconductor technology and his impressive portfolio of patents highlight his significant role as an inventor. His contributions continue to influence the development of electronic devices and systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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