Koninklijke Philips Corporation N.v.

Nxp B.v.

Joachim Heinz Schober

Marcus Toth

Gerald Schaffler

Rainer Moll

Christian Zenz

Christian Scherabon

Peter Schmallegger

Reinhard Fritz

Andreas Muehlberger

Veronika Sauer

Anton Salfener

Wolfgang Steinbauer

Gunter Aflenzer

A semiconductor chip () for a transponder () comprises a chip substrate () with a surface (), chip terminals () arranged on the surface (), and a passivation layer () covering the surface () and completely covering the chip terminals (), so that an antenna () with antenna terminals () can be attached to the chip () above the chip terminals (), so that the chip terminals (), the passivation layer () and the antenna terminal () form first capacitors.

Semiconductor chip, transponder and method of manufacturing a transponder

The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.

Chip card for insertion into a holder

A microelectronic package assembly comprises a lead frame having a holding bar () and a microelectronic package (). The microelectronic package () comprises a package body () and a connecting element () for connecting the package body () to the holding bar () of the lead frame (). The connecting element () extends from an outer surface () of the package body () and is engaged with an ending part () of the holding bar ().

Microelectronic package assembly, method for disconnecting a microelectronic package

In a module base unit () for a module () for a data carrier, two connection plates () are provided, which comprise electrically conductive material and which each have a direction of extent () and which are separated from each other by a gap () transverse to the two directions of extent (), and at least one strain relief member () is connected to the two connection plates (), which strain relief member () is constructed to absorb tensile forces occurring parallel to the directions of extent () and acting on the connection plates ().

Module base unit with strain relief means

The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.

Lead-frame configuration for chips

In the case of a product () having a first product sub-part () and a second product sub-part (), the two product sub-parts () each comprise two connection zones () consisting of metal and of suitably thin construction for a crimping process and the connection zones () are connected together in pairs by means in each case of a crimp connection, in which the connection zones () of at least one product sub-part () exhibit the remnants (), remaining after performance of the crimping process, of elevations () present prior to performance of the crimping process.

Product comprising product sub-parts connected to each other by a crimp connection

A module ( ) for a data carrier ( ) for performing of operations with contacts and operations without contacts comprising an integrated component ( ) with component connections (A , A , A , A , A , A , A ) and having a contact field ( ) accessible to counter contacts with module connecting contacts (C , C , C , C , C , C , C , C ), with each component connection (A , A , A , A , A ) used for operations with contacts being in an electrically conductive connection with a module connecting contact (C , C , C , C , C ) of the contact field ( ) and each component connection (A , A ) used for operations without contacts also being in an electrically conductive connection with a module connecting contact (C , C ) of the contact field ( ).

Data carrier comprising an array of contacts

A data carrier ( ) includes an IC module ( ), having a substrate ( ), and a conductor configuration ( ) connected to the substrate ( ), and an IC ( ) connected to the substrate ( ), and connecting leads ( ) between the conductor configuration ( ) and the IC ( ), and a cover ( ) of an electrically insulating material, which cover ( ) shrouds the IC ( ) and the connecting leads ( ) and the portions ( ) of the conductor configuration ( ) The data carrier ( ) is equipped with a protection mechanism ( ) that provides protection against damage to at least a part of the IC module ( ) when the IC module ( ) is bent or twisted, which protection mechanism ( ) forms a part of the IC module ( ), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover ( ) up to the substrate means ( ).

Data carrier having an IC module with a protection mechanism for protecting the parts of the IC module from mechanical stress

A module ( ) for contactless communication includes a plurality of electrical components ( ) which each have at least two contact faces ( ) for the electrical connection. The electrical components ( ) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module ( ) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A , A , A , A , A , A ) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).

Module having a lead frame equipped with components on both sides

In a data carrier ( ) with a chip module ( ), the chip ( ) of the chip module ( ) is provided, in the region of its chip connecting layers ( ), with a respective wire connecting means which is formed by a flat metal layer ( ) and whereto an end ( ), bonded in a wedge-shape fashion, of a bond wire ( ) is connected.

Chip module with bond-wire connections with small loop height

A method and device is disclosed for determining deviations of a nominally planar surface of a thin object, which is subject to warpage related to gravity, such as a wafer, relative to a reference plane. The method includes supporting the object by three support members and detecting deviations, wherein the three support members are in a position relative to each other so that each support member is located underneath the point of gravity of a circular sector of the object extending over an angular range of 120&deg;.

Method of and device for determining the warpage of a wafer

In a data carrier ( ) with an integrated electronic component ( ) and with a transmission coil ( ), short turn portions ( , and ) of the transmission coil ( ) are formed by connection lines which are provided on the integrated electronic component ( ) in the area of a component surface ( ) of the integrated electronic component ( ) and which are preferably formed by conductor tracks.

Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component

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Graz, Austria

Joachim Heinz Schober