The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
May. 16, 2007
Applicants:
Christian Scherabon, Graz, AT;
Anton Salfener, Pernegg, AT;
Wolfgang Steinbauer, Gratkorn, AT;
Joachim Heinz Schober, Graz, AT;
Inventors:
Christian Scherabon, Graz, AT;
Anton Salfener, Pernegg, AT;
Wolfgang Steinbauer, Gratkorn, AT;
Joachim Heinz Schober, Graz, AT;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); G06K 19/077 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); G06K 19/07756 (2013.01); H01L 23/49855 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/17106 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01055 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/293 (2013.01); H01L 2924/00011 (2013.01);
Abstract
A semiconductor chip () for a transponder () comprises a chip substrate () with a surface (), chip terminals () arranged on the surface (), and a passivation layer () covering the surface () and completely covering the chip terminals (), so that an antenna () with antenna terminals () can be attached to the chip () above the chip terminals (), so that the chip terminals (), the passivation layer () and the antenna terminal () form first capacitors.