This inventor holds 3 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1999-2003.
Company Filing History:
Years Active: 1999-2003
Title: Innovations of Jiun-Chung Lee in Copper CMP Technology
Introduction
Jiun-Chung Lee is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of copper chemical mechanical polishing (CMP). With a total of 3 patents, his work focuses on enhancing the efficiency and accuracy of copper polishing processes.
Latest Patents
One of Jiun-Chung Lee's latest patents is a method for endpoint detection for copper CMP. This innovative approach involves adding a copper isotope to the layer of copper that is deposited to form the metal interface. During the copper polishing process, the radioactivity emitted by the copper layer is measured. The endpoint of the copper CMP is reached when this radioactivity starts to rapidly decrease. Another method he developed measures the radioactivity of the copper slurry that is removed during polishing. The polishing endpoint is determined when the radioactivity of the copper slurry begins to rapidly increase. Additionally, he has proposed a technique that involves adding copper isotopes to the copper seed layer and measuring the radioactivity emitted by the seed layer. The endpoint is reached when the radioactivity emitted by the seed layer starts to rapidly increase.
Career Highlights
Jiun-Chung Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in copper CMP, which is critical for the production of high-performance semiconductor devices.
Collaborations
Throughout his career, Jiun-Chung Lee has collaborated with several talented individuals, including Fu-Sheng Lee and Chien-Chen Chen. These collaborations have contributed to the development of innovative solutions in the semiconductor manufacturing process.
Conclusion
Jiun-Chung Lee's contributions to copper CMP technology demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in the polishing process, paving the way for more efficient manufacturing techniques.