Takatsuki, Japan

Jitsuho Hirota

This inventor holds 2 USPTO granted patents. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2003-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jitsuho Hirota. Retrieved from https://idiyas.com/inventor/jitsuho-hirota-qscahjom

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2003-2004

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2 patents (USPTO):Explore Patents

Title: Jitsuho Hirota: Innovator in Electronic Component Mounting

Introduction

Jitsuho Hirota is a notable inventor based in Takatsuki, Japan. He has made significant contributions to the field of electronic component mounting, holding 2 patents that enhance the efficiency and reliability of mounting processes.

Latest Patents

Hirota's latest patents include a connection method and connection structure of pad electrodes, as well as inspecting methods for the connection state thereof. This innovative connection method utilizes solder bumps for component-side and substrate-side pad electrodes, making it adaptable to high-density mounting. It allows for the miniaturization of products formed by mounting surface-mount components onto substrates. The substrate-side pad electrodes are strategically arranged within a component-corresponding region, ensuring that the length of these electrodes exceeds that of the corresponding component-side pad electrodes. This design facilitates the effective placement of an IC chip, where solder bumps are melted by heating to create reliable connections.

Another significant patent is an electronic component mounting method that enables efficient and reliable mounting of surface-mount components and ICs on a single substrate. This method involves the use of high-temperature solder paste to provisionally fix surface-mount components on electrodes. Additionally, flux is applied to electrodes for receiving ICs, allowing for a seamless reflow-soldering process when heated to high temperatures.

Career Highlights

Hirota is currently employed at Murata Manufacturing Co., Ltd., where he continues to innovate in the field of electronic components. His work has been instrumental in advancing technologies that support the miniaturization and efficiency of electronic devices.

Collaborations

Hirota has collaborated with notable coworkers, including Ryoichi Morimoto and Tatsuya Funaki, contributing to the development of cutting-edge technologies in electronic component mounting.

Conclusion

Jitsuho Hirota's contributions to the field of electronic component mounting through his innovative patents have significantly impacted the industry. His work at Murata Manufacturing Co., Ltd. continues to pave the way for advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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