Murata Manufacturing Co., Ltd.

Jitsuho Hirota

Ryoichi Morimoto

Tatsuya Funaki

A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.

Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof

An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste ( ) is supplied to electrodes ( ) for receiving surface-mount components ( ), and the surface-mount components ( ) are provisionally fixed on the electrodes ( ) with the high-temperature solder paste ( ). In addition, flux ( ) is applied to an electrode ( ) for receiving an IC ( ) that is provided with eutectic solder bumps ( ) or on the eutectic solder bumps ( ), and the IC ( ) is provisionally fixed on the electrode ( ) with the flux ( ). Then, a wiring substrate ( ) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components ( ) and the IC ( ) are reflow-soldered.

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Takatsuki, Japan

Jitsuho Hirota