The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
Jan. 14, 2002
Ryoichi Morimoto, Yasu-gun, JP;
Jitsuho Hirota, Takatsuki, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste ( ) is supplied to electrodes ( ) for receiving surface-mount components ( ), and the surface-mount components ( ) are provisionally fixed on the electrodes ( ) with the high-temperature solder paste ( ). In addition, flux ( ) is applied to an electrode ( ) for receiving an IC ( ) that is provided with eutectic solder bumps ( ) or on the eutectic solder bumps ( ), and the IC ( ) is provisionally fixed on the electrode ( ) with the flux ( ). Then, a wiring substrate ( ) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components ( ) and the IC ( ) are reflow-soldered.