Company Filing History:
Years Active: 2021
Title: Jini Shim - Innovator in Semiconductor Technology
Introduction
Jini Shim is a prominent inventor based in Gyeonggi-do, South Korea. She has made significant contributions to the field of semiconductor technology. Her innovative work has led to the development of a unique semiconductor package that enhances performance and efficiency.
Latest Patents
Jini Shim holds a patent for a semiconductor package and a method of manufacturing the same. This invention relates to a semiconductor package that electrically connects a semiconductor chip and a printed circuit board using a solder ball. The semiconductor package includes a thermal buffer layer positioned on the semiconductor chip, which absorbs and disperses heat generated by the chip. This design increases the distance between the semiconductor chip and the printed circuit board, thereby decreasing the deviation of the heat conduction process. The thermal buffer layer has a thickness ranging from 7.5 to 50% of the diameter of the solder ball. Jini Shim has 1 patent to her name.
Career Highlights
Jini Shim is currently employed at Nepes Co., Ltd., where she continues to innovate in semiconductor technology. Her work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.
Collaborations
Jini Shim collaborates with talented individuals in her field, including her coworkers Yong Tae Kwon and Hee Cheol Kim. Their combined expertise contributes to the success of their projects and the advancement of semiconductor technology.
Conclusion
Jini Shim is a remarkable inventor whose contributions to semiconductor technology are noteworthy. Her innovative patent demonstrates her commitment to improving the efficiency of semiconductor packages. Her work at Nepes Co., Ltd. and collaborations with skilled professionals further highlight her impact in the field.