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Title: Innovations of Jing-Ye Juang
Introduction
Jing-Ye Juang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on advanced packaging and semiconductor structures, which are crucial for modern electronic devices.
Latest Patents
Juang's latest patents include "Reconstructed substrates for high I/O counts application and methods for forming the same." This patent describes a package assembly that features a package substrate with a molding material layer and multiple substrate portions embedded within it. Additionally, it includes a redistribution layer (RDL) structure and several semiconductor devices mounted on the RDL structure. Another notable patent is "Semiconductor structures including glass core layer and methods of forming the same." This patent outlines a method for creating a semiconductor structure that involves forming deep vias in a glass layer, establishing a redistribution layer structure, and bonding a carrier to the structure.
Career Highlights
Jing-Ye Juang has worked with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and the Industrial Technology Research Institute. His experience in these organizations has allowed him to develop innovative solutions that enhance semiconductor performance and reliability.
Collaborations
Juang has collaborated with several notable professionals in his field, including Hsien-Wei Chen and Shin-Puu Jeng. Their combined expertise has contributed to the advancement of semiconductor technologies.
Conclusion
Jing-Ye Juang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of electronic devices.