Singapore, Singapore

Jing Wai Fong

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Micron Technology Incorporated. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Wai Fong. Retrieved from https://idiyas.com/inventor/jing-wai-fong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Jing Wai Fong

Introduction

Jing Wai Fong is a notable inventor based in Singapore, SG. He has made significant contributions to the field of conductive materials, particularly through his innovative patent. With a focus on enhancing electronic connectivity, his work has implications for various technological applications.

Latest Patents

Jing Wai Fong holds a patent for conductive interconnects. This patent includes embodiments that feature conductive interconnects made from first and second conductive materials, which extend upwardly from a conductive structure. Additionally, some embodiments involve integrated assemblies that utilize these conductive interconnects, showcasing his inventive approach to improving electronic components.

Career Highlights

Jing Wai Fong is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His role at Micron allows him to apply his expertise in materials science and engineering to develop cutting-edge technologies. His innovative spirit and dedication to research have positioned him as a valuable asset to his team.

Collaborations

Jing has collaborated with several talented individuals, including Jordan D Greenlee and Rita J Klein. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Jing Wai Fong's contributions to the field of conductive materials exemplify the spirit of innovation. His patent for conductive interconnects highlights his commitment to advancing technology in the semiconductor industry. Through his work at Micron Technology Incorporated, he continues to push the boundaries of what is possible in electronic connectivity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…