The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Aug. 07, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Jordan D. Greenlee, Boise, ID (US);
Rita J. Klein, Boise, ID (US);
Everett A. McTeer, Eagle, ID (US);
John D. Hopkins, Meridian, ID (US);
Shuangqiang Luo, Boise, ID (US);
Song Kai Tan, Singapore, SG;
Jing Wai Fong, Singapore, SG;
Anurag Jindal, Singapore, SG;
Chieh Hsien Quek, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H10B 43/27 (2023.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76843 (2013.01); H01L 21/76847 (2013.01); H01L 21/76877 (2013.01); H10B 43/27 (2023.02); H01L 23/53209 (2013.01); H01L 23/53266 (2013.01);
Abstract
Some embodiments include conductive interconnects which include the first and second conductive materials, and which extend upwardly from a conductive structure. Some embodiments include integrated assemblies having conductive interconnects.