This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2010-2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Gyunggi-do, KR (2010)
- Suwon-si, KR (2014)
Company Filing History:
Years Active: 2010-2014
Title: The Innovative Contributions of Jing Li Yuan
Introduction
Jing Li Yuan is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his expertise and innovative spirit. His work primarily focuses on improving manufacturing processes and enhancing the reliability of electronic components.
Latest Patents
One of Jing Li Yuan's latest patents is titled "Stacked Wafer Level Package and Method of Manufacturing the Same." This invention addresses the misalignment issues that can occur during the stacking process of semiconductor chips. By implementing a method that includes bonding internal connection means to a conductive layer before the stacking process, this innovation enhances reliability, yield, and reduces manufacturing costs.
Another significant patent is the "Method for Manufacturing Semiconductor Package." This method involves the use of a cap substrate wafer and a device substrate wafer, which are bonded together using a primary adhesive. The process includes forming a trench to expose the device substrate and performing a secondary bonding operation to ensure electrical connections. This method represents a step forward in semiconductor packaging technology.
Career Highlights
Jing Li Yuan is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to contribute to cutting-edge technologies in semiconductor packaging, further establishing his reputation as an innovator in the field.
Collaborations
Throughout his career, Jing has collaborated with talented individuals such as Seung Wook Park and Young Do Kweon. These collaborations have fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.
Conclusion
Jing Li Yuan's contributions to the field of semiconductor packaging through his patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key innovator. His inventions not only improve manufacturing processes but also enhance the reliability of electronic components, making a lasting impact on the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile