Jing Li

Title: Innovations of Jing Li in Semiconductor Technology

Introduction

Jing Li is a prominent inventor based in Chongqing, China, known for her contributions to semiconductor technology. With a total of 4 patents, she has made significant advancements in the field, particularly in the area of interconnects.

Latest Patents

One of her latest patents is titled "Interconnects with improved TDDB." This patent presents a method for forming a semiconductor device. The process begins with a substrate prepared with a dielectric layer formed thereon. A first upper etch stop layer is then formed on the dielectric layer, which includes a first dielectric material. The dielectric layer and first upper etch stop layer are patterned to create an interconnect opening. This opening is subsequently filled with a conductive material to form an interconnect. Notably, the interconnect and first upper etch stop layer have coplanar top surfaces. A second upper etch stop layer is formed over these coplanar surfaces, which includes a second material that has sufficient adhesion with the first material to reduce the diffusion of the conductive material.

Career Highlights

Jing Li has worked with notable companies in the semiconductor industry, including Globalfoundries Singapore Pte. Ltd. and IBM. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Throughout her career, Jing has collaborated with talented individuals such as Wu Ping Liu and Johnny Widodo. These collaborations have fostered an environment of innovation and creativity, leading to the development of advanced technologies.

Conclusion

Jing Li's work in semiconductor technology exemplifies her dedication to innovation and excellence. Her patents and collaborations highlight her significant impact on the industry.