This inventor holds 2 USPTO granted patents. Top assignee: Chipmos Technologies (Bermuda) Ltd. Active years: 2011-2012.
Company Filing History:
Years Active: 2011-2012
Title: Innovations of Jing-Hong Yang in Bump Structure Technology
Introduction
Jing-Hong Yang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor manufacturing, particularly in the development of bump structures. With a total of 2 patents, his work focuses on enhancing the reliability and efficiency of electronic components.
Latest Patents
Yang's latest patents include a manufacturing method of a bump structure with an annular support. This innovative method involves several steps, starting with the provision of a substrate that includes pads and a passivation layer. The passivation layer features first openings that expose portions of the pads. An under ball metal (UBM) material layer is then formed to cover both the passivation layer and the pads. A patterned photoresist layer is applied, which has second openings that expose the UBM material layer over the pads. Notably, the diameter of each second opening on the lower surface of the patterned photoresist layer is less than that on the upper surface. Bumps are subsequently formed in these openings, and a portion of the patterned photoresist layer is removed to create an annular support around each bump. The UBM material layer is then patterned using the annular supports and bumps as masks to form UBM layers.
Another patent by Yang describes a bump structure with an annular support that is suitable for placement on a substrate. This structure includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is positioned on the passivation layer, covering the pad that is exposed. The bump is placed on the UBM layer over the pad, with the diameter of the lower surface of the bump being less than that of the upper surface. The annular support surrounds and contacts the bump, made from photoresist material, which helps prevent undercut effects on the bump structure.
Career Highlights
Jing-Hong Yang is currently associated with Chipmos Technologies (Bermuda) Ltd., where he continues to innovate in the semiconductor industry. His expertise in bump structure technology has positioned him as a key player in enhancing electronic component manufacturing processes.
Collaborations
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Conclusion
Jing-Hong Yang's contributions to bump structure technology reflect his commitment to advancing semiconductor manufacturing. His innovative