Chipmos Technologies (bermuda) Ltd

Jing-Hong Yang

A manufacturing method of a bump structure with an annular support includes the following steps. A substrate including pads and a passivation layer is provided. The passivation has first openings exposing a portion of the pads. An UBM material layer is formed to cover the passivation layer and the pads. A patterned photoresist layer, having second openings respectively exposing the UBM material layer over the pads, is formed on the UBM material layer. A diameter of each second opening located on a lower surface of the patterned photoresist layer is less than that located on an upper surface of the patterned photoresist layer. Bumps are formed in the second openings. A portion of the patterned photoresist layer is removed to form an annular support at a periphery of each bump. The UBM material layer is patterned using the annular supports and the bumps as masks to form UBM layers.

Manufacturing method of bump structure with annular support

A bump structure with an annular support suitable for being disposed on a substrate is provided. The substrate has at least one pad and a passivation layer that has at least one opening exposing a portion of the pad. The bump structure with the annular support includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is disposed on the passivation layer and covers the pad exposed by the passivation layer. The bump is disposed on the UBM layer over the pad, and a diameter of a lower surface of the bump is less than the diameter of an upper surface thereof. The annular support surrounds and contacts the bump, and a material of the annular support is photoresist. An under cut effect is not apt to happen on the bump structure.

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Shanghai, China

Jing-Hong Yang