Kaohsiung, Taiwan

Jing-Da Li

This inventor holds 2 USPTO granted patents. Top assignee: Vanguard International Semiconductor Corporation. Active years: 2023-2025.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):Explore Patents

Title: Jing-Da Li: Innovator in Semiconductor Technology

Introduction

Jing-Da Li is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative diode structures and semiconductor devices that enhance performance and efficiency.

Latest Patents

Jing-Da Li's latest patents include a diode structure and a semiconductor structure. The diode structure features a substrate with a first conductivity type and a first well region with a second conductivity type. This design includes a ring-shaped well region and an anode, which collectively improve the functionality of the diode. The semiconductor structure patent outlines a method for forming a semiconductor structure that involves multiple dielectric layers and gate structures, showcasing his expertise in advanced semiconductor fabrication techniques.

Career Highlights

Jing-Da Li is currently employed at Vanguard International Semiconductor Corporation, where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing new technologies that are crucial for modern electronic devices.

Collaborations

Throughout his career, Jing-Da Li has collaborated with notable colleagues, including Kai-Chuan Kan and Chih-Cherng Liao. These partnerships have fostered a collaborative environment that enhances the innovation process.

Conclusion

Jing-Da Li's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in electronic devices and semiconductor manufacturing.

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