This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Jin Soo Bae - Innovator in Semiconductor Technology
Introduction
Jin Soo Bae is a prominent inventor based in Seongnam-si, South Korea. He is known for his contributions to semiconductor technology, particularly in the development of innovative semiconductor packages. His work has significantly impacted the performance and reliability of electronic devices.
Latest Patents
Jin Soo Bae holds a patent for a semiconductor package that enhances performance and reliability. The patent describes a semiconductor package that includes a first device and a second device that are electrically connected. The first device features a substrate, a first pad on the upper side of the substrate, and a passivation film surrounding the first pad. The second device includes a second pad facing the first pad. Notably, the first pad has a center pad with a first elastic modulus and an edge pad with a smaller elastic modulus, designed to improve the overall functionality of the semiconductor package. He has 1 patent to his name.
Career Highlights
Jin Soo Bae is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to advancements in the semiconductor field. His expertise and innovative approach have made him a valuable asset to the company.
Collaborations
Throughout his career, Jin Soo Bae has collaborated with notable colleagues, including Hyung Gyun Noh and Keun-Ho Rhew. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Jin Soo Bae is a distinguished inventor whose work in semiconductor technology has made a significant impact on the industry. His innovative patent and contributions at Samsung Electronics Co., Ltd. highlight his dedication to improving electronic device performance and reliability.
