The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Feb. 02, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyung Gyun Noh, Hwaseong-si, KR;
Keun-Ho Rhew, Seoul, KR;
Sang Woo Pae, Suwon-si, KR;
Jin Soo Bae, Seongnam-si, KR;
Deok-Seon Choi, Hwaseong-si, KR;
Il-Joo Choi, Anyang-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
The present disclosure provides a semiconductor package capable of improving performance and reliability. The semiconductor package of the present disclosure includes a first device and a second device that are electrically connected to each other, the first device includes a substrate, a first pad formed on an upper side of the substrate, and a passivation film formed on the upper side of the substrate and formed to surround the first pad, the second device includes a second pad placed to face the first pad, and the first pad has a center pad having a first elastic modulus and an edge pad having a second elastic modulus smaller than the first elastic modulus, the edge pad formed to surround the center pad and to contact the passivation film.