This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Hyung Gyun Noh: Innovator in Semiconductor Packaging
Introduction
Hyung Gyun Noh is a prominent inventor based in Hwaseong-si, South Korea. He is known for his contributions to the field of semiconductor packaging, which plays a crucial role in enhancing the performance and reliability of electronic devices. His innovative approach has led to the development of a unique semiconductor package that addresses key challenges in the industry.
Latest Patents
Hyung Gyun Noh holds a patent for a semiconductor package that significantly improves performance and reliability. The patent describes a semiconductor package that includes a first device and a second device that are electrically connected. The first device features a substrate, a first pad on the upper side of the substrate, and a passivation film surrounding the first pad. The second device includes a second pad that faces the first pad. Notably, the first pad has a center pad with a first elastic modulus and an edge pad with a second elastic modulus that is smaller than the first. This innovative design enhances the overall functionality of the semiconductor package.
Career Highlights
Hyung Gyun Noh is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to collaborate with some of the brightest minds in the industry, contributing to advancements in semiconductor technology.
Collaborations
Throughout his career, Hyung Gyun Noh has worked alongside talented colleagues, including Keun-Ho Rhew and Sang Woo Pae. These collaborations have fostered an environment of innovation and creativity, leading to significant advancements in their respective fields.
Conclusion
Hyung Gyun Noh's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent reflects a commitment to improving electronic device performance and reliability. As he continues to work at Samsung Electronics, his future endeavors are likely to further impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile