Samsung Electronics Co., Ltd.

Jin Soo Bae

Sang Woo Pae

Deok-Seon Choi

Il-Joo Choi

Hyung Gyun Noh

Keun-Ho Rhew

The present disclosure provides a semiconductor package capable of improving performance and reliability. The semiconductor package of the present disclosure includes a first device and a second device that are electrically connected to each other, the first device includes a substrate, a first pad formed on an upper side of the substrate, and a passivation film formed on the upper side of the substrate and formed to surround the first pad, the second device includes a second pad placed to face the first pad, and the first pad has a center pad having a first elastic modulus and an edge pad having a second elastic modulus smaller than the first elastic modulus, the edge pad formed to surround the center pad and to contact the passivation film.

Growing community of inventors

Seongnam-si, South Korea

Jin Soo Bae