Hsinchu, Taiwan

Jin-Shan Pan

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2008-2016

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6 patents (USPTO):Explore Patents

Title: Innovations of Jin-Shan Pan

Introduction

Jin-Shan Pan is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work primarily focuses on advancements in laser diodes and related packaging devices.

Latest Patents

One of his latest patents is a chip array structure for laser diodes. This innovative design features a semiconductor chip with multiple light-emitting elements arranged in an array. It includes insulation walls that separate the light-emitting elements into distinct districts, ensuring electrical isolation. The design also incorporates wire bond areas and connection electrodes that facilitate efficient electrical coupling.

Another significant patent involves an inputting module and its submount. This submount is designed for the placement of illuminant or light-receiving elements. It features a main body with surfaces that are strategically tilted to align the optical axis of the elements at a predetermined angle. This design enhances the functionality and efficiency of the optical components.

Career Highlights

Jin-Shan Pan is currently employed at Truelight Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in developing advanced solutions that improve the performance of laser diodes and related devices.

Collaborations

He collaborates with talented coworkers, including Chih-Cheng Chen and Cheng-Ju Wu. Their combined expertise contributes to the success of their projects and the advancement of technology at Truelight Corporation.

Conclusion

Jin-Shan Pan's contributions to semiconductor technology through his innovative patents demonstrate his commitment to advancing the field. His work continues to influence the development of efficient laser diodes and packaging solutions.

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