The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Sep. 19, 2014
Applicant:

Truelight Corporation, Hsinchu, TW;

Inventors:

Jin-Shan Pan, Hsinchu, TW;

Chih-Cheng Chen, Taoyuan County, TW;

Hsiu-Ming Hsieh, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/42 (2006.01); H01S 5/022 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01S 5/42 (2013.01); H01S 5/02276 (2013.01); H01L 27/156 (2013.01); H01S 5/423 (2013.01);
Abstract

A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.


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