Jin Ho Ha

Title: Jin Ho Ha: Innovator in Wafer Level Packaging

Introduction

Jin Ho Ha is a prominent inventor based in Osan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and manufacturing methods.

Latest Patents

Jin Ho Ha holds a patent for a wafer level package and its manufacturing method. This invention includes a substrate with bonding pads and a first protection dam, featuring multiple circuit pattern units on one side. Additionally, it incorporates a printed circuit board with connection pads, a second protection dam, and via holes. The connection unit links some of the connection pads and the second protection dam on the printed circuit board. This design enhances freedom of design and improves the reliability of the wafer level package. Furthermore, the manufacturing process is simplified by omitting the bridge process during wiring design, allowing for a reduction in the size of the elements involved. He has 1 patent to his name.

Career Highlights

Jin Ho Ha is currently employed at Wisol Co., Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has been instrumental in advancing wafer level packaging technologies.

Collaborations

Some of his notable coworkers include Jung Hoon Han and Eun Tae Park, who contribute to the collaborative efforts in their projects.

Conclusion

Jin Ho Ha's contributions to wafer level packaging demonstrate his commitment to innovation and excellence in the semiconductor field. His work not only simplifies manufacturing processes but also enhances the reliability and design flexibility of electronic components.