The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
May. 30, 2018
Wisol Co., Ltd., Osan-si, Gyeonggi-do, KR;
Jung Hoon Han, Osan-si, KR;
Eun Tae Park, Osan-si, KR;
Jin Ho Ha, Osan-si, KR;
Jun Woo Yong, Osan-si, KR;
WISOL CO., LTD., Osan-si, Gyeonggi-Do, KR;
Abstract
A wafer level package includes a substrate including bonding pads and a first protection dam and having a plurality of circuit pattern units disposed on a side; a printed circuit board having a plurality of connection pads, a second protection dam and via holes disposed thereon; and a connection unit connected to some of the plurality of connection pads and the second protection dam disposed on the printed circuit board. Freedom of design can be improved through the wafer level package and the manufacturing method thereof, and reliability of the wafer level package can be improved. The manufacturing process can be simplified as the bridge process is omitted when wiring is designed, and the size of an element may be reduced.