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Gyeonggi-do, South Korea

Wisol Co., Ltd.

USPTO Granted Patents = 37

EPO Patents = 1

Trademarks = 1

Forward Citations = 18

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56 inventors (with patents filed for the assignee):

Byung Hun Kim (6 out of 18 patents)

Yo Sep Choi (4 out of 4 patents)

Chul Hwa Lee (4 out of 4 patents)

4. Jae Hyung Choi (4 out of 5 patents)

5. Jong Hyeon Park (4 out of 4 patents)

6. Jung Rae Noh (3 out of 3 patents)

7. Yong Hun Ko (3 out of 3 patents)

8. Young Hun Kim (3 out of 3 patents)

9. Hoan Jun Choi (2 out of 2 patents)

10. Yukihiro Noro (2 out of 2 patents)

11. Jung Hoon Han (2 out of 2 patents)

12. Eun Tae Park (2 out of 2 patents)

13. Jun Woo Yong (2 out of 2 patents)

14. Dong Jun You (2 out of 2 patents)

15. Hunyong Lee (2 out of 2 patents)

37 patents: Sort by Forward Citations

1. 12451863 - Bulk acoustic wave resonator and method of manufacturing bulk acoustic wave resonator (2025-10-21),

2. 12451862 - Surface acoustic wave wafer level packages with organic solderability preservative coating layers and manufacturing methods thereof (2025-10-21),

3. 12334905 - Acoustic resonator (2025-06-17),

4. 12249975 - Film bulk acoustic resonator chip and package structure with improved power tolerance (2025-03-11),

5. 12199587 - Surface acoustic wave device and manufacturing method thereof (2025-01-14),

6. 12126326 - Film bulk acoustic resonator (2024-10-22),

7. 12126325 - Acoustic resonator (2024-10-22),

8. 12003228 - Air-gap type FBAR (2024-06-04),

9. 11996823 - Air-gap type film bulk acoustic resonator (2024-05-28),

10. 11955949 - Resonator, and filter and duplexer having the same (2024-04-09),

11. 11949405 - Double mode surface acoustic wave (SAW) filter (2024-04-02),

12. 11949401 - Film bulk acoustic resonator package with thin film sealing structure and manufacturing method therefor (2024-04-02),

13. 11870414 - Film bulk acoustic resonator chip and package structure with improved temperature coefficient (2024-01-09),

14. 11799446 - Resonator, and filter and duplexer using the same (2023-10-24),

15. 11777467 - Air-gap type film bulk acoustic resonator (2023-10-03),

WISOL CO., LTD. is a global pioneer in the design and manufacture of wireless communication modules and solutions. With expertise in IoT, LPWA, and M2M technologies, WISOL provides high-quality, reliable, and innovative products to industries worldwide. Their extensive range of modules includes solutions for LTE-M, NB-IoT, Cat M1, LoRaWAN, Sigfox, and more. WISOL aims to empower businesses with cutting-edge wireless connectivity solutions that enable seamless integration and efficient data communication.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

37 Patents

#31 in Gyeonggi-do

#379 in South Korea

#17,724 in the World

Gyeonggi-do, South Korea

Wisol Co., Ltd.

Forward Citations = 18

56 inventors:

Byung Hun Kim (6 out of 18 patents)

Yo Sep Choi (4 out of 4 patents)

Chul Hwa Lee (4 out of 4 patents)

4. Jae Hyung Choi (4 out of 5 patents)

5. Jong Hyeon Park (4 out of 4 patents)

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