The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jun. 15, 2021
Applicant:
Wisol Co., Ltd., Gyeonggi-do, KR;
Inventors:
Assignee:
WISOL CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1092 (2013.01); H03H 3/08 (2013.01); H03H 9/059 (2013.01); H03H 9/25 (2013.01);
Abstract
A surface acoustic wave wafer level package includes a substrate, an interdigital transducer (IDT) formed on the substrate, a sidewall formed on the substrate along a periphery of the IDT, a cover formed above the sidewall and the IDT to form a hollow above the IDT with the sidewall, a connection electrode formed on the substrate and extending outward from a periphery of the sidewall, a connection terminal electrically connected to a part of the connection electrode which extends outward from the periphery of the sidewall, and an organic solderability preservative coating layer formed on at least a top surface of the connection terminal.